CoolIT - Split-Flow Coldplate System - High-Performance Liquid Cooling Coldplate

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SKU:
Split-Flow Coldplate System
Weight:
1.50 LBS
Width:
4.00 (in)
Height:
0.75 (in)
Depth:
4.00 (in)
The CoolIT Split-Flow Coldplate System is a high-performance liquid cooling solution engineered for high-density compute environments, including HPC and AI workloads. It utilizes advanced split-flow technology to optimize thermal resistance and ensure uniform cooling across high-wattage processors. - Patented split-flow technology for superior thermal performance and heat dissipation. - Designed for high-TDP CPUs and GPUs in enterprise and HPC server environments. - Low pressure drop design to maximize coolant flow efficiency across the loop. - Compatible with a wide range of server architectures and modern socket types. - Robust construction using high-quality copper for maximum thermal conductivity. - Scalable solution suitable for multi-processor and multi-node configurations. - Fully integrated into CoolIT’s comprehensive Direct Liquid Cooling (DLC) ecosystem. - Optimized for warm water cooling to significantly improve data center PUE. - Rigorous testing and validation for long-term reliability in mission-critical systems.

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