The CoolIT Split-Flow Coldplate System is a high-performance liquid cooling solution engineered for high-density compute environments, including HPC and AI workloads. It utilizes advanced split-flow technology to optimize thermal resistance and ensure uniform cooling across high-wattage processors.
- Patented split-flow technology for superior thermal performance and heat dissipation.
- Designed for high-TDP CPUs and GPUs in enterprise and HPC server environments.
- Low pressure drop design to maximize coolant flow efficiency across the loop.
- Compatible with a wide range of server architectures and modern socket types.
- Robust construction using high-quality copper for maximum thermal conductivity.
- Scalable solution suitable for multi-processor and multi-node configurations.
- Fully integrated into CoolIT’s comprehensive Direct Liquid Cooling (DLC) ecosystem.
- Optimized for warm water cooling to significantly improve data center PUE.
- Rigorous testing and validation for long-term reliability in mission-critical systems.
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