CoolIT Systems - Modular Liquid Cooling System (OEM) - Data Center Thermal Management

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SKU:
Modular Liquid Cooling System (OEM)
Weight:
150.00 LBS
Width:
19.00 (in)
Height:
7.00 (in)
Depth:
30.00 (in)
High-performance modular liquid cooling solution designed for high-density data centers, AI workloads, and HPC environments. This end-to-end suite integrates advanced coolant distribution units, coldplates, and manifolds to provide efficient heat dissipation for next-generation server architectures. - Comprehensive modular product suite including CDUs, coldplates, and rack manifolds. - Optimized for high-density AI, HPC, and enterprise computing workloads. - Direct Liquid Cooling (DLC) technology for superior thermal efficiency. - Scalable architecture designed to support multi-gigawatt production capacities. - High-efficiency Coolant Distribution Units (CDUs) for precise thermal management. - Custom-engineered coldplate loops for specific CPU and GPU architectures. - Reliable rack manifolds for seamless integration into existing data center rows. - Supports warm water cooling to reduce reliance on traditional chillers and lower PUE. - Rigorous testing and validation conducted at LiquidLab™ innovation centers. - Global manufacturing and support for large-scale international deployments.

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