Submer - SmartPodX - Modular Liquid Immersion Cooling System

The Submer SmartPodX series provides a high-density, liquid immersion cooling solution designed to optimize data center efficiency and sustainability. By submerging IT hardware in a non-toxic, biodegradable dielectric fluid, these pods eliminate the need for traditional air cooling infrastructure while protecting components from environmental degradation. - Supports standard 19-inch, 21-inch, and OCP server configurations for maximum flexibility. - High-density thermal management optimized for AI, HPC, and enterprise-grade workloads. - Significant reduction in Power Usage Effectiveness (PUE) and direct water consumption. - Utilizes dielectric fluid that is non-toxic, biodegradable, and features zero Global Warming Potential (GWP). - Protects sensitive hardware from dust, moisture, and mechanical vibrations to extend component lifespan. - Compatible with existing chilled or warm water loops for efficient heat rejection and recovery. - Tool-less server access designed for simplified maintenance and hot-swappable IT operations. - Modular design allows for rapid deployment and scalable data center capacity growth. - Integrated cable management system specifically engineered for liquid-cooled environments. - Future-proof infrastructure capable of supporting multiple IT hardware generations without vendor lock-in.