CoolIT - Rack DCLC Passive Coldplate Loop - Server Liquid Cooling Assembly

The CoolIT Rack DCLC Passive Coldplate Loop is a high-performance liquid cooling assembly designed for direct-to-chip heat removal in high-density server environments. It utilizes a passive design to circulate coolant through precision-engineered coldplates, effectively managing thermal loads for high-TDP CPUs, GPUs, and memory modules. - Direct Contact Liquid Cooling (DCLC) technology for maximum heat transfer efficiency. - Passive loop design minimizes mechanical failure points within the server chassis. - Compatible with high-TDP processors including latest generation enterprise CPUs and GPUs. - Precision-machined copper coldplates for optimized thermal conductivity and contact. - Leak-free quick disconnect (QD) couplings for simplified installation and maintenance. - Flexible, high-pressure rated tubing engineered for long-term reliability in data centers. - Modular architecture supports various server configurations and rack densities. - Reduces reliance on high-velocity air cooling, significantly lowering facility PUE. - Seamlessly integrates with CoolIT Rack Manifolds and Coolant Distribution Units (CDUs). - Supports warm water cooling to enhance overall energy efficiency and sustainability.