The NVIDIA GB200 Liquid Cooling Module is a critical thermal management component designed for the Blackwell architecture, specifically the GB200 Grace Blackwell Superchip. It enables high-density AI compute by efficiently dissipating heat from high-TDP components in rack-scale configurations.
- Designed specifically for NVIDIA GB200 Grace Blackwell Superchips.
- Supports liquid-to-liquid heat exchange for maximum thermal efficiency.
- Optimized for NVL72 rack-scale liquid cooling deployments.
- Reduces data center power consumption compared to traditional air cooling.
- High-reliability leak-detection and prevention mechanisms.
- Enables sustained peak performance for LLM training and inference.
- Compatible with standard data center CDU (Cooling Distribution Unit) interfaces.
- Engineered for high-density compute environments with limited airflow.
- Supports quick-disconnect fittings for simplified maintenance and serviceability.
- Integrated thermal sensors for real-time monitoring and management.
NVIDIA
NVIDIA - GB200 Liquid Cooling Module - High-Performance AI Infrastructure Cooling
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- SKU:
- GB200 Liquid Cooling Module
- Weight:
- 18.50 LBS
- Width:
- 19.00 (in)
- Height:
- 1.75 (in)
- Depth:
- 28.00 (in)
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