The Motivair In-Rack Manifold System provides precise coolant distribution to high-density server racks, enabling efficient heat removal for liquid-cooled IT equipment. Designed for seamless integration into standard server enclosures, these manifolds support Direct-to-Chip (D2C) and Rear Door Heat Exchanger (RDHx) applications.
- Stainless steel construction for corrosion resistance and long-term reliability
- Integrated dripless quick-connect couplings for hot-swappable server maintenance
- Scalable design supporting various rack heights and power densities
- Optimized flow distribution to ensure uniform cooling across all server nodes
- Low pressure drop architecture to maximize pump efficiency
- Available in single or dual-loop configurations for redundancy
- Compatible with water-glycol mixtures and dielectric fluids
- Factory-tested for leak-free operation under high-pressure conditions
- Flexible mounting options for side-of-rack or rear-of-rack installation
- Supports high-wattage CPUs and GPUs in AI and HPC environments
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