High-performance direct-to-chip liquid cooling loop designed for high-density server environments and high-TDP processors. This kit provides efficient heat removal directly from the silicon, enabling increased compute density and reduced energy consumption in enterprise data centers.
- Direct-to-chip (D2C) liquid cooling technology for maximum thermal efficiency.
- Compatible with high-TDP CPUs and GPUs in enterprise server configurations.
- Includes precision-engineered cold plates, manifold connections, and flexible tubing.
- Designed for seamless integration with Motivair Coolant Distribution Units (CDUs).
- Leak-free quick-disconnect couplings for easy maintenance and hot-swapping.
- Optimized fluid dynamics to minimize pressure drop across the loop.
- Supports high-density rack configurations and AI/HPC workloads.
- Reduces reliance on facility air conditioning and lowers overall Power Usage Effectiveness (PUE).
Motivair - Cooling Loop Kit (Direct-to-Chip) - Liquid Cooling Solution
For a quote, contact us at info@tropical.com
- SKU:
- Cooling Loop Kit (Direct-to-Chip)
- Weight:
- 7.50 LBS
- Width:
- 12.00 (in)
- Height:
- 4.00 (in)
- Depth:
- 12.00 (in)
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