Vertiv

Vertiv - CoolChip Rear Door Heat Exchanger - High-Density Liquid Cooling Solution

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SKU:
CoolChip Rear Door Heat Exchanger
Weight:
220.00 LBS
Width:
23.60 (in)
Height:
78.70 (in)
Depth:
5.00 (in)
The Vertiv CoolChip Rear Door Heat Exchanger is a high-performance liquid cooling solution designed for high-density AI and HPC environments. It replaces the standard rear door of a server rack to capture heat at the source, significantly reducing the load on room-level air conditioning. - Passive or active cooling configurations for high-density rack applications. - Optimized for AI, machine learning, and high-performance computing (HPC) workloads. - Seamless integration with standard 19-inch or 21-inch server racks. - High-efficiency heat transfer using chilled water or glycol loops. - Reduces data center PUE by minimizing mechanical cooling requirements. - Space-saving design maintains standard rack footprint. - Compatible with Vertiv Liebert XDU Coolant Distribution Units. - Redundant fan options available for active cooling models. - Leak detection and monitoring capabilities for mission-critical reliability.

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