The Vertiv CoolChip Rear Door Heat Exchanger is a high-performance liquid cooling solution designed for high-density AI and HPC environments. It replaces the standard rear door of a server rack to capture heat at the source, significantly reducing the load on room-level air conditioning.
- Passive or active cooling configurations for high-density rack applications.
- Optimized for AI, machine learning, and high-performance computing (HPC) workloads.
- Seamless integration with standard 19-inch or 21-inch server racks.
- High-efficiency heat transfer using chilled water or glycol loops.
- Reduces data center PUE by minimizing mechanical cooling requirements.
- Space-saving design maintains standard rack footprint.
- Compatible with Vertiv Liebert XDU Coolant Distribution Units.
- Redundant fan options available for active cooling models.
- Leak detection and monitoring capabilities for mission-critical reliability.
Vertiv
Vertiv - CoolChip Rear Door Heat Exchanger - High-Density Liquid Cooling Solution
For a quote, contact us at info@tropical.com
- SKU:
- CoolChip Rear Door Heat Exchanger
- Weight:
- 220.00 LBS
- Width:
- 23.60 (in)
- Height:
- 78.70 (in)
- Depth:
- 5.00 (in)
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