The NVIDIA GB200 Grace Blackwell Superchip connects two NVIDIA Blackwell GPUs and one NVIDIA Grace CPU over a 900GB/s ultra-low-latency NVLink-C2C interconnect. It is engineered to power the most demanding generative AI and high-performance computing (HPC) workloads in modern data centers.
- Architecture: NVIDIA Blackwell architecture featuring second-generation Transformer Engine technology.
- Interconnect: 900GB/s bidirectional bandwidth via high-speed NVLink-C2C interface.
- Memory: Integrated High-Bandwidth Memory (HBM3e) for massive data throughput and processing.
- Performance: Delivers up to 30x faster real-time LLM inference compared to H100-based systems.
- Efficiency: Up to 25x lower TCO and energy consumption for trillion-parameter model training.
- Scalability: Optimized for integration into GB200 NVL72 rack-scale liquid-cooled systems.
- Precision Support: Native support for FP4 and FP6 precision formats for optimized AI inference.
- Security: Advanced confidential computing features for secure multi-tenant data protection.
- Software: Fully compatible with NVIDIA AI Enterprise and the CUDA-X software stack.
NVIDIA
NVIDIA - GB200 Dual Superchip Module - AI and HPC Accelerator
For a quote, contact us at info@tropical.com
- SKU:
- GB200 Dual Superchip Module
- Weight:
- 12.00 LBS
- Width:
- 15.00 (in)
- Height:
- 3.00 (in)
- Depth:
- 10.00 (in)
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