High-density single-phase immersion cooling system designed for high-performance computing (HPC) and AI workloads. This solution utilizes natural convection and dielectric fluid to provide superior thermal management for CPUs and GPUs while significantly reducing energy consumption.
- Single-phase immersion cooling for high-density CPU and GPU workloads.
- Natural convection and Directed Forced Convection (DFC) technology.
- Up to 40% improvement in CPU performance over air-cooled systems.
- Reduces datacenter CAPEX and OPEX by approximately 45%.
- Compact design offers an 80% reduction in physical footprint.
- 99% of energy is captured and ready for heat reuse applications.
- Integrated power distribution, networking, and monitoring systems.
- Zero water consumption for sustainable datacenter operations.
- Modular, plug-and-play architecture for rapid deployment.
- Fully contained system with easy access to hardware components.
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