-
APC
Refrigerant Distribution Unit 750mm
Refrigerant Distribution Unit, 750mm, 100-240V, 50/60HzUSD33,436.84 -
Asus
ESC8000A-E12P-3W10G
AMD EPYC 9004 dual-processor 4U GPU server that supports eight dual-slot GPUs, PCIe 5.0 Switch Solution, liquid cooling solution, up to 24 DIMM, 13 PCIe 5.0 slots, eight NVMe, four 3000W Titanium power supplies, OCP 3.0 and ASMB11-iKVMUSD9,315.96 -
Asus
ESC8000-E11-3W10G
4U dual-socket GPU server powered by 4th Gen Intel Xeon Scalable processors that supports eight dual-slot GPUs, liquid cooling solution, 32 DIMM, 11 PCIe 5.0, dual NVMe, four 3000W Titanium power supplies, OCP 3.0, and ASUS ASMB11-iKVMUSD6,394.16 -
Asus
ESC8000A-E12-26W10G
AMD EPYC 9004 dual-processor 4U GPU server that supports eight dual-slot GPUs, PCIe 5.0 Switch Solution, liquid cooling solution, up to 24 DIMM, 13 PCIe 5.0 slots, eight NVMe, four 3000W Titanium power supplies, OCP 3.0 and ASMB11-iKVMUSD6,218.81 -
APC
3FT SS FLEX PIPE KIT 1 MPT TO 1 FPT
3ft (0.9144m) Stainless Flex Pipe Kit 1 MPT to 1 FPT UnionUSD1,083.18 -
Asetek - InRackCDU D2C - In-Rack Coolant Distribution Unit
The Asetek InRackCDU D2C is a high-performance coolant distribution unit designed for direct-to-chip liquid cooling in data center environments. It facilitates efficient heat removal from high-density server racks by circulating liquid coolant directly... -
APC
CDU Flexible Fluid Piping - 300 Feet (91.4 Meters)
CDU Flexible Fluid Piping - 300 Feet (91.4 Meters) -
CoolIT - OMNI Cold Plate - CPU/GPU Direct Liquid Cooling
The CoolIT OMNI Cold Plate is a high-performance direct liquid cooling (DLC) solution designed for high-density data center workloads, including AI and HPC. Utilizing proprietary Split-Flow technology, it provides targeted heat dissipation for CPUs and... -
CoolIT - Split-Flow DLC Coldplate System - Direct Liquid Cooling Solution
The CoolIT Split-Flow DLC Coldplate System is a high-performance direct liquid cooling solution designed for high-density HPC and AI workloads. It utilizes patented split-flow technology to provide superior thermal management for the latest generation of... -
Motivair - Cooling Loop Kit (Direct-to-Chip) - Liquid Cooling Solution
High-performance direct-to-chip liquid cooling loop designed for high-density server environments and high-TDP processors. This kit provides efficient heat removal directly from the silicon, enabling increased compute density and reduced energy... -
Motivair - Dynamic Cold Plate (AMD MI300X) - High-Performance Liquid Cooling Plate
High-performance direct-to-chip liquid cooling solution engineered specifically for the AMD Instinct™ MI300X accelerator. Designed to manage the extreme thermal densities of next-generation AI and HPC workloads while optimizing energy efficiency. •... -
Motivair - Dynamic Cold Plate (Intel Sapphire Rapids) - Direct-to-Chip Liquid Cooling Solution
The Motivair Dynamic Cold Plate is a high-performance direct-to-chip liquid cooling solution specifically engineered for Intel Sapphire Rapids (4th Gen Xeon Scalable) processors. It enables efficient thermal management for high-density server...